RSS Bot Posted July 21, 2022 Share Posted July 21, 2022 ARIES Embedded MSMP1 OSM-compatible system-in-package (SiP) based on STM32MP1 CortexA7/M4 microcontroller for Industrial and IoT applications follows the company’s MSRZG2UL and MSRZFive OSM-compatible SiPs with Renesas Arm or RISC-V microprocessor introduced a few months ago. But instead of coming in the ultra-compact 30×30 mm OSM Size S form factor, the new MSMP1 complies with the larger 45x30mm OSM Size L form factor with a total of 476 contacts to allow for more I/Os. The SiP also integrates 512 MB to 4 GB DDR3L RAM, and 4 to 64 GB eMMC flash. MSMP1 SIP specifications: SoC – STMicro STM32MP1 single or dual-core Arm Cortex-A7 processor up to 800MHz, with Arm Cortex-M4 real-time core up to 209MHz, Vivante GPU compatible with OpenGL ES 2.0 System Memory – 512MB – 4GB DDR3L RAM Storage – 4GB – 64GB eMMC NAND Flash 476-contact LGA with Networking – Gigabit Ethernet USB – USB 2.0 Host/OTG [...] The post OSM Size L SiP Integrates STM32MP1 MPU for industrial & IoT applications appeared first on CNX Software - Embedded Systems News. View the full article Link to comment Share on other sites More sharing options...
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