RSS Bot Posted August 4, 2022 Share Posted August 4, 2022 Benjamin VERNOUX has launched the HydraUSB3 V1 board based on WCH CH569 RISC-V MCU as a developer platform to experiment with high-speed protocols like HSPI and SerDes through a USB 3.0 interface. It’s the third board from Benjamin we feature here, after the STM32-based HydraBUS and the HydraNFC v2 shield delivering up to 1600 mW for NFC charging and connectivity. The HydraUSB3 v1 is quite different since it does not involve NFC at all, and instead leverages the CH569’s high-speed interfaces including USB 3.0 (5 Gbps), HSPI (3.8Gbps), and SerDes (>1.2Gbps). HydraUSB3 V1 specifications: MCU – WCH CH569 32-bit RISC-V (RISC-V3A) RV32IMAC MCU @ 120MHz with 16KB 32-bit SRAM, 96KB configurable 128-bit SRAM, 448KB code flash, 32KB data flash USB – 1x USB 3.0 host/device port that supports the USB 3.0 SS built-in PHY (5Gbps) and USB 2.0 built-in PHY FS/LS/HS (480Mbps) High-speed I/Os High-Speed Parallel Interface (HSPI) up to [...] The post HydraUSB3 RISC-V MCU board combines USB 3.0 with HSPI and SerDes high-speed interfaces appeared first on CNX Software - Embedded Systems News. View the full article Link to comment Share on other sites More sharing options...
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