RSS Bot Posted August 26, 2022 Share Posted August 26, 2022 IEI’s WAFER-TGL-U is a 3.5-inch SBC based on a choice of Intel Tiger Lake UP3 processors with up to 32GB RAM, SATA storage, three 2.5 Gbps Ethernet ports, four display interfaces including HDMI, DisplayPort, and the company’s custom iDPM 3040 slot for eDP/LVDS/VGA, as well as four USB 3.2 ports. The board also comes with M.2 sockets to add 4G LTE or 5G cellular connectivity, a few RS232/RS422/RS485 ports, and IEI says it is ideal for space-constrained applications such as AGV (Automated Guided Vehicle), AMR (Autonomous Mobile Robot), and small cabinets in factories. WAFER-TGL-U specifications: Tiger Lake UP3 SoC (One or the other) Intel Core i7-1185G7E quad-core processor up to 4.4GHz 12MB cache, TDP=28/15/12W Intel Core i5-1145G7E quad-core processor up to 4.1GHz, 8MB Cache, TDP=28/15/12W Intel Core i3-1115G4E dual-core processor up to 3.9GHz, dual-core, 6M Cache, TDP=28/15/12W Intel Celeron 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP=15W) System Memory – [...] The post WAFER-TGL-U 3.5-inch Tiger Lake SBC offers 3x 2.5GbE port, SATA, 4x display interfaces appeared first on CNX Software - Embedded Systems News. View the full article Link to comment Share on other sites More sharing options...
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