RSS Bot Posted March 23, 2023 Posted March 23, 2023 Octavo Systems OSD62x is a system-in-package (SiP) combining the Texas Instruments AM62x processor with LPDDR4 RAM, EEPROM, power management, oscillators, and passive components, plus optional features such as an RTC and an 8-channel ADC. At least that’s true for the OSD62x Max Integration SiP (22×22 mm BGA), but Octavo Systems also have a smaller 14x9mm package called the OSD62x Size Optimized with “just’ the AM62x processor, LPDDR4 memory, and passive components. OSD62x “Max Integration” specifications: SoC – Texas Instruments AM62x (AM623/AM625) CPU – Up to 4x Arm Cortex-A53 @ 1.4GHz MCU – Arm Cortex-M4F GPU – 3D graphics up to 2048×1080 @ 60 fps (AM625 only) Storage I/F – 1x eMMC, 2x SDIO, 1x GPMC Display I/F – 24-bit RGB MIPI DPI and OLDI/LVDS Camera I/F – 1x MIPI CSI-2 with DPHY 1.2 Networking – 2x 10/100/1000M Gigabit Ethernet with TSN support USB – 2x USB 2.0 interfaces PRU-ICSS Other [...] The post OSD62x SiP combines TI AM62x processor with LPDDR4, EEPROM, PMIC, and passives into a single package appeared first on CNX Software - Embedded Systems News. View the full article
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