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  1. Description Most of Realtek drivers have a bug: P2P IE not passed to AP beacon. This causes problems, when P2P-GO looks like a regular AP. All P2P capable devices can't see my P2P-GO in the list. I found a driver where P2P-GO works fine (according to user reviews): https://github.com/aircrack-ng/rtl8812au And found these differences. After I backported these changes my P2P-GO works fine. Also this changes is totally safe, because affects only P2P-related code This patch contains my patches to the original driver repo: jwrdegoede/rtl8189ES_linux#87 jwrdegoede/rtl8189ES_linux#88 But the owner is too busy to review that :( How Has This Been Tested? Create /etc/wpa_supplicant/wpa_supplicant-wlan0.conf ctrl_interface=/var/run/wpa_supplicant update_config=1 device_name=orangepilite device_type=1-0050F204-1 config_methods=virtual_push_button p2p_no_group_iface=1 Setup DHCP for the wlan0: /etc/systemd/network/wlan0.network [Match] Name=wlan0 [Network] Address=10.7.7.7/24 DHCPServer=true IPMasquerade=ipv4 [DHCPServer] PoolOffset=100 PoolSize=20 EmitDNS=yes DNS=1.1.1.1 Setup services # We don't need NM sudo systemctl disable NetworkManager sudo systemctl stop NetworkManager # For test we need systemd-networkd sudo systemctl enable systemd-networkd sudo systemctl start systemd-networkd # Useless without NM sudo systemctl stop wpa_supplicant sudo systemctl disable wpa_supplicant # Enable wpa_supplicant for wlan0 sudo systemctl enable wpa_supplicant@wlan0 sudo systemctl start wpa_supplicant@wlan0 Now create P2P-GO: sudo wpa_cli p2p_group_add Open on android "Wifi Direct" section in settings. Now you can see "orangepilite" device in the list. Just click it! Accept join req from your phone to P2P-GO sudo wpa_cli wps_pbc In wpa_supplicant logs you can see something like that: <3>P2P-DEVICE-FOUND xx:xx:xx:xx:xx:xx p2p_dev_addr=xx:xx:xx:xx:xx:xx pri_dev_type=10-0050F204-5 name='Android_6d7f' config_methods=0x188 dev_capab=0x25 group_capab=0x0 new=1 <3>P2P-PROV-DISC-PBC-REQ xx:xx:xx:xx:xx:xx p2p_dev_addr=xx:xx:xx:xx:xx:xx pri_dev_type=10-0050F204-5 name='Android_6d7f' config_methods=0x188 dev_capab=0x25 group_capab=0x0 <3>WPS-PBC-ACTIVE <3>P2P-PROV-DISC-PBC-REQ xx:xx:xx:xx:xx:xx p2p_dev_addr=xx:xx:xx:xx:xx:xx pri_dev_type=10-0050F204-5 name='Android_6d7f' config_methods=0x188 dev_capab=0x25 group_capab=0x0 <3>CTRL-EVENT-SUBNET-STATUS-UPDATE status=0 <3>CTRL-EVENT-EAP-STARTED xx:xx:xx:xx:xx:xx <3>CTRL-EVENT-EAP-PROPOSED-METHOD vendor=0 method=1 <3>CTRL-EVENT-EAP-PROPOSED-METHOD vendor=14122 method=254 <3>WPS-REG-SUCCESS xx:xx:xx:xx:xx:xx xxxxxxxx-xxxx-xxxx-xxxx-xxxxxxxxxxxx <3>WPS-PBC-DISABLE <3>WPS-SUCCESS <3>CTRL-EVENT-EAP-FAILURE xx:xx:xx:xx:xx:xx <3>CTRL-EVENT-SUBNET-STATUS-UPDATE status=0 <3>AP-STA-CONNECTED xx:xx:xx:xx:xx:xx p2p_dev_addr=xx:xx:xx:xx:xx:xx <3>EAPOL-4WAY-HS-COMPLETED xx:xx:xx:xx:xx:xx That's successful connection. Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [ ] I have made corresponding changes to the documentation [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  2. Description This address https://github.com/armbian/build/pull/4656#issuecomment-1373549295 How Has This Been Tested? [X] Build [X] Run Checklist: [ ] My code follows the style guidelines of this project [X] I have performed a self-review of my own code [ ] I have commented my code, particularly in hard-to-understand areas [ ] I have made corresponding changes to the documentation [ ] My changes generate no new warnings [ ] Any dependent changes have been merged and published in downstream modules View the full article
  3. Description This PR includes a patch that fixes: HDMI sound. X11 cursor flickering (https://github.com/radxa/kernel/pull/50) Missing resolutions (https://github.com/orangepi-xunlong/linux-orangepi/commit/6947bce36393fc034389ab1eef6f18a5ea64f17d) HDMI-CEC feature (https://github.com/radxa/kernel/commit/d35989ed644b9d67de09849779e5147f4332df55) How Has This Been Tested? [x] I compiled kernel and tested sound, flickering. [x] Confirmed adding missing resolutions -> https://forum.armbian.com/topic/25600-wip-current-issues/#comment-156823 [x] HDMI-CEC is confirmed by @catalinii. Orange Pi has CEC but i'm not able to test it. Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [x] I have made corresponding changes to the documentation [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  4. You may soon be able to get true global coverage even in remote areas thanks to Qualcomm Snapdragon Satellite which will offer pole-to-pole coverage and two-way messaging for emergency use, SMS texting, and other messaging applications. Qualcomm made this possible through a partnership with Iridium to bring satellite-based connectivity to next-generation premium Android smartphones starting with devices based on Snapdragon 8 Gen 2 Mobile Platform, while emergency messaging support was done in collaboration with Garmin. You’ll just need to point your phone to the sky to send and/or receive messages, and the connection should take place within a few seconds. Note it can only be used for text, and the bandwitdh would not be sufficient for audio, pictures, and videos. The solution relies on Snapdragon 5G Modem-RF Systems such as the Snapdragon X70 modem to connect to the Iridium low-earth orbit satellite constellation using the L-band spectrum (1 to 2 [...] The post Qualcomm Snapdragon Satellite enables two-way messaging using the Iridium network appeared first on CNX Software - Embedded Systems News. View the full article
  5. Description This address https://github.com/armbian/build/pull/4656#issuecomment-1373549295 How Has This Been Tested? [X] Build Checklist: [ ] My code follows the style guidelines of this project [X] I have performed a self-review of my own code [X] I have commented my code, particularly in hard-to-understand areas [ ] I have made corresponding changes to the documentation [X] My changes generate no new warnings [ ] Any dependent changes have been merged and published in downstream modules View the full article
  6. Description Lets rather show success percentage instead of binary values. Before: true / false After: % How Has This Been Tested? You see the difference. Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  7. Espressif ESP32-P4 is a general-purpose dual-core RISC-V microcontroller clocked at up to 400 MHz with AI instructions extension, numerous I/Os, and security features. It also happens to be the first microcontroller from Espressif Systems without wireless connectivity, and as such, it should probably be seen as an alternative to STM32F7/H7 or NXP i.RT Arm Cortex-M7 microcontrollers/crossover processors, and likely offered at a significantly lower cost. It should also offer lower power consumption than other ESP32 chips thanks in part to a third RISC-V core clocked at 40 MHz that can keep the system running while the other two high-performance cores are down. ESP32-P4 key features and specifications: MCU subsystems Dual-core RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU, 768KB of on-chip SRAM Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz with 8KB of zero-wait TCM RAM Memory & Storage I/F [...] The post Espressif ESP32-P4 – A 400 MHz general-purpose dual-core RISC-V microcontroller appeared first on CNX Software - Embedded Systems News. View the full article
  8. Orbbec Femto Mega is a programmable multi-mode 3D depth and RGB camera based on NVIDIA Jetson Nano system-on-module and based on Microsoft ToF technology found in Hololens and Azure Kinect DevKit. As an upgrade of the earlier Orbbec Femto, the camera is equipped with a 1MP depth camera with a 120 degrees field of view and a range of 0.25m to 5.5m as well as a 4K RGB camera, and enables real-time streaming of processed images over Ethernet or USB. Orbbec Femto Mega specifications: SoM – NVIDIA Jetson Nano system-on-module Cameras 1MP depth camera Precision: ≤17mm Accuracy: < 11 mm + 0.1% distance NFoV unbinned & binned:H 75°V 65° WFoV unbinned & binned:H 120°V 120° Resolutions & framerates NFoV unbinned: 640×576 @ 5/15/25/30fps NFoV binned: 320×288 @ 5/15/25/30fps WFoV unbinned: 1024×1024 @ 5/15fps NFoV binned: 512×512 @ 5/15/25/30fps 4K RGB camera FOV – H: 80°, V: 51°b D: 89°±2° Resolutions [...] The post Orbbec Femto Mega 3D depth and 4K RGB camera features NVIDIA Jetson Nano, Microsoft ToF technology appeared first on CNX Software - Embedded Systems News. View the full article
  9. the old way caused the compilation to abort with a syntax error. idk why, but it did, this is how I got it to work. Jira reference number [AR-9999] How Has This Been Tested? with these changes it now compiles without syntax error using ubuntu jammy LTS as recommended by docs View the full article
  10. Banana Pi BPI-CM4 system-on-module powered by an Amlogic A311D hexa-core Cortex-A73/A53 processor and compatible with the Raspberry Pi CM4 module has now been launched for $95 and up. Banana Pi introduced the Raspberry Pi CM4 compatible module with Amlogic A311D CPU last May with some 3D renders and specifications, and we expected a launch in Q4 2022 or Q1 2023 at the time. The Banana Pi BPI-CM4 is now available together with a carrier board so let’s have another look. Banana Pi BPI-CM4 specifications: SoC – Amlogic A311D hexa-core processor with 4x Arm Cortex-A73 @ 2.0 GHz and 2x Arm Cortex-A53, Arm Mali-G52 MP4 (6EE) GPU, 5 TOPS NPU System Memory – 4GB LPDDR4 RAM Storage – 16GB eMMC flash (up to 128GB) Networking Realtek RTL8211F Gigabit Ethernet PHY on-module Dual-band WiFi 5 up to 867Mbps and Bluetooth 5.2 via Realtek RTL8822CS module and 2x u.FL antenna connectors 2x 100-pin [...] The post Banana Pi BPI-CM4 Amlogic A331D system-on-module launched for $95 appeared first on CNX Software - Embedded Systems News. View the full article
  11. MSI Cubi N ADL is one of the first mini PCs based on the Alder Lake-N processor family. The mini PC will be offered with Intel Processor N100 or N200 quad-core processor and up to 16GB RAM, as well as M.2 SSD and 2.5-inch SATA storage support. The low-power mini PC also offers 4Kp60 capable HDMI and DisplayPort video output ports, two Gigabit Ethernet ports, WiFi 5 and Bluetooth connectivity, and a range of USB ports. MSI Cubi N ADL specifications: SoC Intel Processor N100 quad-core processor @ up to 3.4 GHz (Turbo) with 6MB cache, 24EU Intel HD graphics; TDP: 6W Intel Processor N200 quad-core processor @ up to 3.7 GHz (Turbo) with 6MB cache, 32EU Intel HD graphics; TDP: 6W System Memory – Up to 16GB single channel DDR4 3200MHz memory via one SO-DIMM socket Storage 1x M.2 SSD (auto switch) 1x 2.5-inch SSD / HDD Video Output [...] The post MSI Cubi N ADL – An Intel Processor N100/N200 Alder Lake-N mini PC appeared first on CNX Software - Embedded Systems News. View the full article
  12. NXP i.MX 95 is an upcoming Arm processor family for automotive, industrial, and IoT applications with up to six Cortex-A55 application cores, a Cortex-M33 safety core, a Cortex-M7 real-time core, and NXP eIQ Neutron Neural Network Accelerator (NPU). We’re just only starting to see NXP i.MX 93 modules from companies like iWave Systems and Forlinx, but NXP is already working on its second i.MX 9 processor family with the i.MX 95 application processor family equipped with a higher number of Cortex-A55 cores, an Arm Mali 3D GPU, NXP SafeAssure functional safety, 10GbE, support for TSN, and the company’s eIQ Neutron Neural Processing Unit (NPU) to enable machine learning applications. NXP i.MX 95 specifications: CPU Up to 6x Arm Cortex-A55 cores with 32KB I-cache, 32KB D-cache, 64KB L2 cache, 512KB L3 cache with ECC 1x Arm Corex-M7 real-time core with 32KB I-cache, 32KB D-cache, 512KB TCM with ECC 1x Arm Cortex-M33 [...] The post NXP i.MX 95 processor features Cortex-A55, Cortex-M33, and Cortex-M7 cores, eIQ Neutron NPU appeared first on CNX Software - Embedded Systems News. View the full article
  13. bananapim2s: rename u-boot patch folder, required, since board file was renamed in #4644 View the full article
  14. The Raspberry Pi Pico W board was launched with a WiFi 4 and Bluetooth 5.2 LE module based on the Infineon CYW43439 wireless chip in June 2022, and I wrote a tutorial showing how to connect to WiFi a few days after the launch, but nothing about Bluetooth LE. That’s because while the Raspberry Pi Pico W hardware supports Bluetooth LE, we were told that Bluetooth was not enabled at the time, but might be at a later stage. The good news comes from Alasdair Allan, who is responsible for the Raspberry Pi documentation, saying Bluetooth LE support is scheduled for the upcoming 1.5.0 release of the Pico C SDK. There’s currently an open ticket on GitHub for Bluetooth support added to the 1.5.0 milestone. At the time of writing, there are 14 open issues for the 1.5.0 milestone with no due date, but Alistair expects to see support publically [...] The post Raspberry Pi Pico W to get Bluetooth LE support very soon appeared first on CNX Software - Embedded Systems News. View the full article
  15. Description Add support for sd card for Rock 5 (mainline linux) Remove tegra from kernel config Update Linux kernel to rc2 How Has This Been Tested? I builded image and Rock 5 boot up from sd card/emmc and I was able to reboot [x] boot up from emmc [x] boot up from sd card [x] reboot Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [x] I have made corresponding changes to the documentation [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  16. Description This finally brings mvebu edge to 6.1. Two patches had to be disabled for compilation to work. 91-01-libata-add-ledtrig-support.patch 91-02-Enable-ATA-port-LED-trigger.patch these manly affect helios4 and it needs to be checked if ATA LED still works without them. Jira reference number AR-1313 How Has This Been Tested? Ran compile.sh with clearfogpro, testing on actual hardware shortly. View the full article
  17. Forlinx FET-MX9352-C is a system-on-module based on NXP i.MX 9352 dual Cortex-A55 processor with Cortex-M33 real-time core and a 0.5 TOPS AI accelerator that can be used for industrial control, IoT gateways, medical equipment, and various applications requiring machine learning acceleration. The FET-MX9352-C follows last week’s announcement of the iWave Systems iW-RainboW-G50M OSM module and SBC with a choice of NXP i.MX 93 processors. The Forlinx module comes with two board-to-board connectors instead of solderable pads and can be found in the OK-MX9352-C single board computer with dual GbE, various display and camera interfaces, RS485 and CAN Bus, etc… FET-MX9352-C i.MX 9352 system-on-module Specifications: SoC – NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7GHz (commercial) or 1.5 GHz (industrial), Cortex-M33 real-time core @ 250 MHz, 0.5 TOPS Arm Ethos U65 microNPU System Memory – 1GB/2GB LPDDR4 RAM Storage – 8GB eMMC flash 2x high-density 100-pin board-to-board [...] The post Forlinx FET-MX9352-C – An NXP i.MX 9352 system-on-module for industrial AIoT applications appeared first on CNX Software - Embedded Systems News. View the full article
  18. ASRock Industrial NUC 1300 BOX and NUCS 1300 BOX series mini PCs are equipped with Intel 13th generation Raptor Lake-P mobile processors up to the Core i7-1360P 12-core hybrid processor with four Performance cores and eight Efficiency cores. Yesterday, we wrote about the ADLINK Express-RLP COM Express module based on Raptor Lake-P embedded or industrial processors, but ASRock decided to use Raptor Lake-P mobile processors in their industrial “fanned embedded box PCs” coupled with up to 64GB DDR5 memory, and featuring high-speed interfaces such as USB4, 2.5GbE, and more. NUCS 1300 BOX Series Two NUCS 1300 Box models are available with either an Intel Core i7-1360P or i5-1340P processor. NUCS 1300 Box specifications: Raptor Lake-P SoC NUCS BOX-1340P/D4 – Intel Core i5-1340P 12-core (4P @ 1.9/4.6 GHz + 8E @ 1.4/3.4 GHz) processor with 80EU Intel Iris Xe Graphics; PBP: 28W, MTP: 64W NUC BOX-1360P/D4 – Intel Core i7-1360P 12-core [...] The post ASRock NUC 1300 BOX/ NUCS 1300 BOX mini PCs are powered by Intel Raptor Lake-P mobile processors appeared first on CNX Software - Embedded Systems News. View the full article
  19. Description Beta builds are not able to start X11 since 3dsupport group is exists on images. Oibaf PPA is definitely incompatible with RK3588 boards. It's not also exists on main target config. I also added beta build option for CLI. If you are not OK to that, i can remove it. How Has This Been Tested? [x] I didn't test it but i'm sure 3dsupport breaks X11 on RK3588 boards. (I built an image that have Oibaf PPA and it wasn't also able to get X11) Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [x] I have made corresponding changes to the documentation [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  20. Pentium and Celeron brands are officially dead with Intel introducing the Alder Lake-N family comprised of “Intel Processor” and Core-i3 N-series processors based on the Gracemont “Efficiency” cores found in Alder Lake hybrid processors. Some of the details about the Intel Processor N100 and N200 processors were leaked last fall, followed by the Core i3-N300 and Core i3-N350, but at least it is now official, and we have more details so let’s dig into it. Alder Lake N-series key features and specifications: CPU – Up to 8x Gracemont Efficient cores for Core i3 N-series processor, and up to 4x with Intel Processor processor GPU – Intel UHD graphics with AV1 decode support Memory I/F – LPDDR5-4800, DDR4, DDR5 Storage I/F – eMMC/UFS 2.1 flash, 2x SATA 3.0 Video Output eDP 1.4b / MIPI DSI 1.3 DisplayPort 1.4 HDMI 2.0b Up to 3x independent displays Camera I/F – MIPI CSI Networking [...] The post Meet Intel Processor and Core-i3 N-series “Alder Lake N-series” processors appeared first on CNX Software - Embedded Systems News. View the full article
  21. ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up [...] The post COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors appeared first on CNX Software - Embedded Systems News. View the full article
  22. Description Applied series correctly How Has This Been Tested? Please describe the tests that you ran to verify your changes. Please also note any relevant details for your test configuration. [ ] Test A [ ] Test B Checklist: [ ] My code follows the style guidelines of this project [ ] I have performed a self-review of my own code [ ] I have commented my code, particularly in hard-to-understand areas [ ] I have made corresponding changes to the documentation [ ] My changes generate no new warnings [ ] Any dependent changes have been merged and published in downstream modules View the full article
  23. MediaTek Genio 700 is an octa-core Arm processor with two Cortex-A78 cores, six Cortex-A55 cores, a Mali-G57 GPU, and a 4 TOPS AI accelerator designed for consumer and industrial IoT applications. The new processor is a cost-down version of the Genio 1200 premium AIoT processor introduced last year with four Cortex-A78 and four Cortex-A55 cores. The Genio 700 offers many of the same features but with lower performance/capabilities, including a 3-core GPU and an AI accelerator limited to 4.0 TOPS, as well as support for dual displays up to 4K + Full HD (instead of 2x 4K), and 32MP single cameras (instead of 48 MP). MediaTek Genio 700 specifications: CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz, 6x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC3 GPU VPU Encoding up to 4Kp60 with H.265/HEVC Decoding up to 4Kp75, AV1, VP9, HEVC, [...] The post MediaTek Genio 700 Cortex-A78/A55 IoT processor targets industrial and Smart Home applications appeared first on CNX Software - Embedded Systems News. View the full article
  24. Description GitHub provides issue forms for opening an issue. Lets implement it and improve UX. Jira reference number AR-1470 How Has This Been Tested? Demo: https://github.com/igorpecovnik/linux-orangepi/issues/new/choose Checklist: [x] My code follows the style guidelines of this project [x] I have performed a self-review of my own code [x] I have commented my code, particularly in hard-to-understand areas [x] My changes generate no new warnings [x] Any dependent changes have been merged and published in downstream modules View the full article
  25. Description We expect some changes, so lets have this image ready at each rebuild. View the full article
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