RSS Bot Posted January 20, 2023 Share Posted January 20, 2023 Frore Systems Airjet Mini and Airjet Pro are active cooling chips that are just 2.8mm thick and quietly suck cool air in from the top of the chip before pushing it out the sides with the aim to replace traditional fan-based solutions in ultrabooks, or be integrated into VR headsets and smartphones for improved cooling. Yesterday we saw that cameras could clean themselves with micro-vibrations, and it happens that processors can be cooled with vibrations too as the Airjet chips are comprised of tiny membranes that vibrate at ultrasonic frequencies to generate a flow of air that enters through inlet vents in the top and transformed into high-velocity pulsating jets exiting from the sides of the chip. The AirJet module is actually not placed directly on the processor in ultrabooks but on copper pipes because it allows for thinner designs that way. The company says the AirJet Mini and Pro [...] The post Quiet, ultrathin AirJet solid state active cooling could replace fans appeared first on CNX Software - Embedded Systems News. View the full article Link to comment Share on other sites More sharing options...
Recommended Posts