allen--smithee

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  1. not surprised, and very mature decision of the team. Thank Kobol Team for your hard work, your fruit continues to feed our needs here. let us know if you decide to plant again.
  2. @tionebrr Source : https://www.rockchip.fr/RK3399 datasheet V1.8.pdf 1.2.1 Microprocessor  Dual-core ARM Cortex-A72 MPCore processor and Quad-core ARM Cortex-A53MPCore processor, both are high-performance, low-power and cached application processor  Two CPU clusters.Big cluster with dual-coreCortex-A72 is optimized for high-performance and little cluster with quad-core Cortex-A53 is optimized for low power. <... >  PD_A72_B0: 1st Cortex-A72 + Neon + FPU + L1 I/D cache of big cluster  PD_A72_B1: 2nd Cortex-A72+ Neon + FPU + L1 I/D cache of big cluster <... >  PD_A53_L0: 1st Cortex-A53 + Neon + FPU + L1 I/D Cache of little cluster  PD_A53_L1: 2nd Cortex-A53 + Neon + FPU + L1 I/D Cache of little cluster  PD_A53_L2: 3rd Cortex-A53 + Neon + FPU + L1 I/D Cache of little cluster  PD_A53_L3: 4th Cortex-A53 + Neon + FPU + L1 I/D Cache of little cluster <...> 3.2 Recommended Operating Conditions The below table describes the recommended operating condition for every clock domain. Table 3-2 Recommended operating conditions Parameters Symbol Min Typ Max Units Supply voltage for Cortex A72 CPU BIGCPU_VDD 0.80 0.90 1.25 V Supply voltage for Cortex A53 CPU LITCPU_VDD 0.80 0.90 1.20 V Max frequency of Cortex A72 CPU 1.8 GHz Max frequency of Cortex A53 CPU 1.4 GHz
  3. thank you for your feedback. don't bet an winning horses, but on a solution to a specific problem. every one of my problems were software...!! I don't minimize yours!
  4. @SalamandarYou cannot do anything without compromising the integrity of the motherboard as it is a hardware limitation and it is announced in the product description (remember 900mA/port USB-A) so there are no surprises here. Its true that it will be very practical (although not necessarily vital) to have a USB-C DAS 3A on the front of the device (Pine User, Hub, HDD, ..) for next gen. Sometimes I am using my USB-C 11in1 Hub with USB-C to USB-A adapter on the front port of the unit and my Hub is powered by the power charge input with my power supply of smartphone 5A.(Native function at the same time : Eth 1G, SD, USB3x3 / USB2x2; not fonctional : Jack3.5mm, VGA and Hdmi).
  5. Line 44 MAX = 255 You will probably want to change this value to your own. nevertheless, I will not advise you not to go below 120, for the obvious reasons cited by @Heisath . If it's still too noisy. you can safely reduce this value (> 35) after modifying the thermal Pad between the board and the heat sink.
  6. Hi @freed00m I think you would like to read /usr/sbin/fancontrol.
  7. If you can shut down or restart the unit after the crash from the front panel buttons then maybe this can help increase HA of your unit. I have no turnkey solution to offer you but your question reminds me of another. Your problem is not that different from his after all. Would meet the needs of RiP WoL, User angst and system crashes. With the UPS on unit you cannot use a smart plug to blow the power. You must act directly on the unit, adding a health companion board that can act on Power and Reset is definitely the best way to go.
  8. The probleme of this post is resolved !! Your Fans with an efficient thermal pad and ssd disks is 22w and 10db peak. I very rarely exceed 12w over a Day and the unit is completely inaudible. Except for doing these tests which does not at all reflect the reality of normal use. Please Kobol make a 2.5 inch version case for Helios. I think will be perfect for as a solution for my home family. (I think of my children in particular and their father .) My ssd and HDDs disks all stay below 40 ° during writing.
  9. @ gprovost As we might expect, there is a little spread of the pads on the outer edges of the processor, but also on the edge of the radiator and so you were right, there is no need to leave the inductors bareheaded. Now I think 19x19 is enough for the dimensions of the cpu thermical pad with a 1.5mm. I redid the separation between the CPU Pad and the rest of the board and put pieces of pad in the slots of the inductors. You don't know if it will be possible so, nevertheless now we know what we need for our next blends at home ;). P6 and P7> PWM = 35 P6 & P7> PWM = 50 is my new PWMMAX on Fancontrol P6 et P7> PWM = 255 @SIGSEGV If you are interested in this solution. I recommend TP-VP04-C 1.5mm for your helios64 (2 plates of 90x50x1.5mm)
  10. @gprovost my Cpu + 2disks fan will always have a PWMMIN=35 my intention is to decrease PWMMAX and to delay the intervention of active ventilation. Before, solicited the cpu made the fans roar, this is no longer the case today. I can perform tasks with the first 5 minutes of a 100% CPU and the unit remains silent and afterwards I don't need a big air flow to stay cold. cat / dev / thermal-board / temp1_input indicates: 10 ° less than the CPU during stress. 1 ° less than the CPU at rest. I have to perform a long test to confirm but I think I can maintain Tcpu100% < 70° (Tboard < 60°) with only PWMMAX = 50 on fan-p6. There are certainly some points to improve concerning the thickness, in my unit, I used a thickness of 1.5 mm for the whole surface. I realized that the inductors were high points on the PCB. My intention was to remove the thermal pad on top so that it would be in direct contact with the radiator. It would be relevant to try with 2mm in order to also cover the inductors from the top. It is planned to dismantle it in a week to see the contact points and check the height in the gel. unfortunately the gel has already sagged, I can't modify the height of the radiator with the elements unless I do a modeling pad workshop, but I can crush a very thin layer of pad at the top of inductor to avoid an air cushion. If necessary I have a second Gelid Pad 90x50x1.5 but I would like to keep it for the next one the 3W solution does the job, it's not the most efficient (not to say an insulator) but it's an economical solution, and intended for most people who use traditional Hard Disk Drives that require active ventilation to improve the life span. My use is particular, after all my unit screws into a living room and uses SDD that heats up little. But it's a point to be improved indeed and if you charge an extra 10$ for a 6W pad you can be sure that I'll take it off to put a better and I'll tell you that your solution was crap.
  11. @SIGSEGV The temperature rise of the cpu is now slow and gentle. I haven't heard my fans all day with these parameters.
  12. After one hour of disassembly, cleaning, cutting, installation and reassembly. My helios64 has gelid thermal pad GP-Ultimate solutions whose manufacturer boasts a small 15W.mK. I think I just solved my ventilation problem for this generation and the following ones. I will do the tests within a week but for the moment Helios64 remains very cold even under full load.
  13. @gprovost Is it possible to know the characteristics of the thermal bridge? (W.mK et thickness) @bunducafe You can use your helios64 without fan with a CPU limitation following : # 816Mhz and 1Ghz (eco) # 1.2Ghz CPU 100% Temp <82 ° (safe) # 1.41Ghz CPU 100% Temp <90 ° (Limit) not viable : # 1.6Ghz CPU100% Temp > 95 ° reboot and reset fancontrol config /etc and there I regret that it is not a K. Nevertheless, it is reassuring to see that the protection method works. From my own personal experience, it is not necessary to change the fans immediately and you will quickly agree thereafter that the noise of the fans is erased by the noise of a single rotating hard disk. But if you use it also as a desk with SSD like me, you would definitely want to use it without limitation. In that event you must familiarize yourself with Fancontrol otherwise you will also be disappointed with your Noctua or any fan.
  14. hi @bunducafe in order of price, time and efficiency. a) you can play with the parameters of fancontrol to find a passive / active fan compromise, and limit the rotational speed and therefore the noise of the fans. (/etc/fancontrol). b) you can also lower the frequency of the processor to reduce its TDP, (armbian-config) c) i do not know the specifications of the thermal bridge (W.mK and thickness) between the CPU and the radiator, maybe this can be replaced to improve thermal conductivity between them. (<10euro) d) New Fans (>30euros)
  15. I am very interested in purchasing a version half case size for 5 SSD/2.5" with the same raw design (I'll take 2 of them !) or half height backplane for the Helios64 exclusively SSD/2.5" between 5 disks in width (10cm) by 8cm in height.